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TECMP: Adding support for two temps in Vendor Data 

The TECMP vendor data format for the Status Capture Module message has
support for two temperatures (chassis and silicon). This patch allows
dissection of those temperatures.
This commit is contained in:
Dr. Lars Völker 2020-10-27 15:39:31 +01:00 committed by AndersBroman
parent 889e0d5cb6
commit ecdd7f3ede
1 changed files with 37 additions and 4 deletions
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41
epan/dissectors/packet-tecmp.c
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@ -153,6 +153,11 @@ static int hf_tecmp_payload_status_cm_vendor_technica_buffer_size = -1;
static int hf_tecmp_payload_status_cm_vendor_technica_lifecycle = -1;
static int hf_tecmp_payload_status_cm_vendor_technica_voltage = -1;
static int hf_tecmp_payload_status_cm_vendor_technica_temperature = -1;
static int hf_tecmp_payload_status_cm_vendor_technica_temperature_chassis = -1;
static int hf_tecmp_payload_status_cm_vendor_technica_temperature_silicon = -1;
#define VENDOR_TECHNICA_TEMP_MAX 127
#define VENDOR_TECHNICA_TEMP_NA -128
/* Status Bus Vendor Data Technica Engineering */
static int hf_tecmp_payload_status_bus_vendor_technica_link_status = -1;
@ -768,6 +773,7 @@ dissect_tecmp_status_cm_vendor_data(tvbuff_t *tvb, packet_info *pinfo _U_, proto
proto_item *ti = NULL;
gint offset = 0;
guint tmp = 0;
gint temperature = 0;
proto_item_append_text(ti_root, " (%s)", val_to_str(vendor_id, tecmp_vendor_ids, "(Unknown Vendor: %d)"));
tree = proto_item_add_subtree(ti_root, ett_tecmp_status_cm_vendor_data);
@ -807,12 +813,33 @@ dissect_tecmp_status_cm_vendor_data(tvbuff_t *tvb, packet_info *pinfo _U_, proto
offset += 8;
tmp = tvb_get_guint16(tvb, offset, ENC_BIG_ENDIAN);
proto_tree_add_string_format(tree, hf_tecmp_payload_status_cm_vendor_technica_voltage, tvb, offset, 2, NULL,
"Voltage: %d.%d V", (tmp & 0x0000ff00) >> 8, tmp & 0x000000ff);
proto_tree_add_string_format_value(tree, hf_tecmp_payload_status_cm_vendor_technica_voltage, tvb, offset, 2, NULL,
"%d.%d V", (tmp & 0x0000ff00) >> 8, tmp & 0x000000ff);
offset += 2;
ti = proto_tree_add_item(tree, hf_tecmp_payload_status_cm_vendor_technica_temperature, tvb, offset, 1, ENC_NA);
proto_item_append_text(ti, " %s", "Degrees Celsius");
if (tvb_captured_length_remaining(tvb, offset) == 1) {
ti = proto_tree_add_item(tree, hf_tecmp_payload_status_cm_vendor_technica_temperature, tvb, offset, 1, ENC_NA);
proto_item_append_text(ti, " %s", "Degrees Celsius");
} else if (tvb_captured_length_remaining(tvb, offset) > 1) {
/* TECMP 1.5 and later */
ti = proto_tree_add_item_ret_int(tree, hf_tecmp_payload_status_cm_vendor_technica_temperature_chassis, tvb, offset, 1, ENC_NA, &temperature);
proto_item_append_text(ti, " %s", "Degrees Celsius");
if (temperature == VENDOR_TECHNICA_TEMP_MAX) {
proto_item_append_text(ti, " %s", "or more");
}
offset += 1;
temperature = tvb_get_gint8(tvb, offset);
if ( temperature == VENDOR_TECHNICA_TEMP_NA) {
proto_tree_add_int_format_value(tree, hf_tecmp_payload_status_cm_vendor_technica_temperature_silicon, tvb, offset, 1, temperature, "%s", "Not Available");
} else {
ti = proto_tree_add_item_ret_int(tree, hf_tecmp_payload_status_cm_vendor_technica_temperature_silicon, tvb, offset, 1, ENC_NA, &temperature);
proto_item_append_text(ti, " %s", "Degrees Celsius");
if (temperature == VENDOR_TECHNICA_TEMP_MAX) {
proto_item_append_text(ti, " %s", "or more");
}
}
}
break;
}
@ -1369,6 +1396,12 @@ proto_register_tecmp_payload(void) {
{ &hf_tecmp_payload_status_cm_vendor_technica_temperature,
{ "Temperature", "tecmp.payload.status_cm.vendor_technica.temperature",
FT_UINT8, BASE_DEC, NULL, 0x0, NULL, HFILL }},
{ &hf_tecmp_payload_status_cm_vendor_technica_temperature_chassis,
{ "Temperature Chassis", "tecmp.payload.status_cm.vendor_technica.temperature_chassis",
FT_INT8, BASE_DEC, NULL, 0x0, NULL, HFILL } },
{ &hf_tecmp_payload_status_cm_vendor_technica_temperature_silicon,
{ "Temperature Silicon", "tecmp.payload.status_cm.vendor_technica.temperature_silicon",
FT_INT8, BASE_DEC, NULL, 0x0, NULL, HFILL } },
/* Status Bus Vendor Data */
{ &hf_tecmp_payload_status_bus_vendor_technica_link_status,