smartcard-fpc: add BOM attributes
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@ -9814,60 +9814,52 @@ contribute to osmocom at https://osmocom.org/</text>
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<class number="0" name="default" width="0.6" drill="0">
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</class>
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</classes>
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<designrules name="default *">
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<description language="de"><b>EAGLE Design Rules</b>
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<p>
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Die Standard-Design-Rules sind so gewählt, dass sie für
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die meisten Anwendungen passen. Sollte ihre Platine
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besondere Anforderungen haben, treffen Sie die erforderlichen
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Einstellungen hier und speichern die Design Rules unter
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einem neuen Namen ab.</description>
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<description language="en"><b>EAGLE Design Rules</b>
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<p>
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The default Design Rules have been set to cover
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a wide range of applications. Your particular design
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may have different requirements, so please make the
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necessary adjustments and save your customized
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design rules under a new name.</description>
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<designrules name="jlcpcb-2layers *">
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<description language="en"><b>JLCPCB design rules (2 layers)</b>
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<ul>
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<li>Board thickness: 1.6mm</li>
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<li>Copper weight: 1oz (35um)</li>
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<li>Note: annular ring aren't minimal</li>
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</ul></description>
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<param name="layerSetup" value="(1*16)"/>
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<param name="mtCopper" value="0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm"/>
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<param name="mtIsolate" value="0.8mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm"/>
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<param name="mdWireWire" value="10mil"/>
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<param name="mdWirePad" value="10mil"/>
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<param name="mdWireVia" value="10mil"/>
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<param name="mdPadPad" value="8mil"/>
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<param name="mdPadVia" value="8mil"/>
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<param name="mdViaVia" value="8mil"/>
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<param name="mdSmdPad" value="8mil"/>
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<param name="mdSmdVia" value="8mil"/>
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<param name="mdSmdSmd" value="8mil"/>
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<param name="mdViaViaSameLayer" value="8mil"/>
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<param name="mtIsolate" value="1.6mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm"/>
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<param name="mdWireWire" value="5mil"/>
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<param name="mdWirePad" value="5mil"/>
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<param name="mdWireVia" value="5mil"/>
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<param name="mdPadPad" value="5mil"/>
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<param name="mdPadVia" value="5mil"/>
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<param name="mdViaVia" value="5mil"/>
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<param name="mdSmdPad" value="5mil"/>
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<param name="mdSmdVia" value="5mil"/>
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<param name="mdSmdSmd" value="5mil"/>
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<param name="mdViaViaSameLayer" value="6mil"/>
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<param name="mnLayersViaInSmd" value="2"/>
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<param name="mdCopperDimension" value="40mil"/>
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<param name="mdDrill" value="8mil"/>
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<param name="mdCopperDimension" value="0.2mm"/>
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<param name="mdDrill" value="6mil"/>
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<param name="mdSmdStop" value="0mil"/>
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<param name="msWidth" value="10mil"/>
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<param name="msDrill" value="24mil"/>
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<param name="msMicroVia" value="9.99mm"/>
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<param name="msWidth" value="5mil"/>
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<param name="msDrill" value="0.3mm"/>
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<param name="msMicroVia" value="0.3mm"/>
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<param name="msBlindViaRatio" value="0.5"/>
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<param name="rvPadTop" value="0.25"/>
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<param name="rvPadInner" value="0.25"/>
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<param name="rvPadBottom" value="0.25"/>
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<param name="rvViaOuter" value="0.25"/>
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<param name="rvViaInner" value="0.25"/>
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<param name="rvMicroViaOuter" value="0.25"/>
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<param name="rvMicroViaInner" value="0.25"/>
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<param name="rvPadTop" value="0.4"/>
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<param name="rvPadInner" value="0"/>
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<param name="rvPadBottom" value="0.4"/>
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<param name="rvViaOuter" value="0"/>
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<param name="rvViaInner" value="0"/>
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<param name="rvMicroViaOuter" value="0"/>
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<param name="rvMicroViaInner" value="0"/>
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<param name="rlMinPadTop" value="10mil"/>
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<param name="rlMaxPadTop" value="20mil"/>
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<param name="rlMaxPadTop" value="80mil"/>
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<param name="rlMinPadInner" value="10mil"/>
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<param name="rlMaxPadInner" value="20mil"/>
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<param name="rlMinPadBottom" value="10mil"/>
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<param name="rlMaxPadBottom" value="20mil"/>
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<param name="rlMinViaOuter" value="8mil"/>
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<param name="rlMaxPadBottom" value="80mil"/>
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<param name="rlMinViaOuter" value="3mil"/>
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<param name="rlMaxViaOuter" value="20mil"/>
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<param name="rlMinViaInner" value="8mil"/>
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<param name="rlMaxViaInner" value="20mil"/>
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<param name="rlMinMicroViaOuter" value="4mil"/>
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<param name="rlMinMicroViaOuter" value="3mil"/>
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<param name="rlMaxMicroViaOuter" value="20mil"/>
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<param name="rlMinMicroViaInner" value="4mil"/>
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<param name="rlMaxMicroViaInner" value="20mil"/>
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@ -9882,7 +9874,7 @@ design rules under a new name.</description>
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<param name="mlMaxStopFrame" value="4mil"/>
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<param name="mlMinCreamFrame" value="0mil"/>
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<param name="mlMaxCreamFrame" value="0mil"/>
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<param name="mlViaStopLimit" value="0mil"/>
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<param name="mlViaStopLimit" value="0.4mm"/>
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<param name="srRoundness" value="0"/>
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<param name="srMinRoundness" value="0mil"/>
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<param name="srMaxRoundness" value="0mil"/>
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@ -9997,8 +9989,11 @@ design rules under a new name.</description>
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<element name="X1" library="iso7816-card" package="ISO7816_CARD" value="" x="42.8" y="26.75"/>
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<element name="X2" library="laforge" package="FPC_JUSHUO_AFA07-S06" value="FCI_FPC_REBEL_SFW6R-1-JUSHUO-AFA07" x="94.234" y="28.194" smashed="yes" rot="R90">
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<attribute name="NAME" x="99.314" y="36.576" size="1.27" layer="25" font="vector" ratio="14" rot="R180"/>
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<attribute name="LCSC_PART" value="C72727" x="94.234" y="28.194" size="1.4224" layer="27" font="vector" ratio="14" rot="R90" display="off"/>
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</element>
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<element name="C1" library="rc-sysmocom" package="_0603" value="100n" x="90.932" y="24.638" rot="R90">
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<attribute name="LCSC_PART" value="C30926" x="90.932" y="24.638" size="1.4224" layer="27" font="vector" ratio="14" rot="R90" display="off"/>
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</element>
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<element name="C1" library="rc-sysmocom" package="_0603" value="" x="90.932" y="24.638" rot="R90"/>
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<element name="U$1" library="laforge" package="WEEE_BIN_TOP" value="" x="77.724" y="11.43" rot="MR0"/>
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<element name="U$2" library="laforge" package="WEEE_BIN" value="" x="77.724" y="8.89" rot="MR0"/>
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<element name="U$3" library="oshw" package="OSHW_8MM" value="" x="93.726" y="8.382"/>
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@ -877,7 +877,7 @@ High volt MLC; no solder stop between for higher isolation</description>
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<part name="X1" library="iso7816-card" deviceset="SMARTCARD" device=""/>
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<part name="FRAME1" library="frames" deviceset="DINA4_L" device=""/>
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<part name="X2" library="laforge" deviceset="FCI_FPC_REBEL_SFW6R-1" device="-JUSHUO-AFA07" value="FCI_FPC_REBEL_SFW6R-1-JUSHUO-AFA07"/>
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<part name="C1" library="rc-sysmocom" deviceset="CAP_CERAMIC" device="_0603"/>
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<part name="C1" library="rc-sysmocom" deviceset="CAP_CERAMIC" device="_0603" value="100n"/>
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</parts>
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<sheets>
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<sheet>
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