smartcard-fpc: add BOM attributes

This commit is contained in:
Harald Welte 2023-01-25 22:00:24 +01:00
parent 7dfb319dc0
commit 122531949d
2 changed files with 40 additions and 45 deletions

View File

@ -9814,60 +9814,52 @@ contribute to osmocom at https://osmocom.org/</text>
<class number="0" name="default" width="0.6" drill="0">
</class>
</classes>
<designrules name="default *">
<description language="de">&lt;b&gt;EAGLE Design Rules&lt;/b&gt;
&lt;p&gt;
Die Standard-Design-Rules sind so gewählt, dass sie für
die meisten Anwendungen passen. Sollte ihre Platine
besondere Anforderungen haben, treffen Sie die erforderlichen
Einstellungen hier und speichern die Design Rules unter
einem neuen Namen ab.</description>
<description language="en">&lt;b&gt;EAGLE Design Rules&lt;/b&gt;
&lt;p&gt;
The default Design Rules have been set to cover
a wide range of applications. Your particular design
may have different requirements, so please make the
necessary adjustments and save your customized
design rules under a new name.</description>
<designrules name="jlcpcb-2layers *">
<description language="en">&lt;b&gt;JLCPCB design rules (2 layers)&lt;/b&gt;
&lt;ul&gt;
&lt;li&gt;Board thickness: 1.6mm&lt;/li&gt;
&lt;li&gt;Copper weight: 1oz (35um)&lt;/li&gt;
&lt;li&gt;Note: annular ring aren't minimal&lt;/li&gt;
&lt;/ul&gt;</description>
<param name="layerSetup" value="(1*16)"/>
<param name="mtCopper" value="0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm"/>
<param name="mtIsolate" value="0.8mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm"/>
<param name="mdWireWire" value="10mil"/>
<param name="mdWirePad" value="10mil"/>
<param name="mdWireVia" value="10mil"/>
<param name="mdPadPad" value="8mil"/>
<param name="mdPadVia" value="8mil"/>
<param name="mdViaVia" value="8mil"/>
<param name="mdSmdPad" value="8mil"/>
<param name="mdSmdVia" value="8mil"/>
<param name="mdSmdSmd" value="8mil"/>
<param name="mdViaViaSameLayer" value="8mil"/>
<param name="mtIsolate" value="1.6mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm"/>
<param name="mdWireWire" value="5mil"/>
<param name="mdWirePad" value="5mil"/>
<param name="mdWireVia" value="5mil"/>
<param name="mdPadPad" value="5mil"/>
<param name="mdPadVia" value="5mil"/>
<param name="mdViaVia" value="5mil"/>
<param name="mdSmdPad" value="5mil"/>
<param name="mdSmdVia" value="5mil"/>
<param name="mdSmdSmd" value="5mil"/>
<param name="mdViaViaSameLayer" value="6mil"/>
<param name="mnLayersViaInSmd" value="2"/>
<param name="mdCopperDimension" value="40mil"/>
<param name="mdDrill" value="8mil"/>
<param name="mdCopperDimension" value="0.2mm"/>
<param name="mdDrill" value="6mil"/>
<param name="mdSmdStop" value="0mil"/>
<param name="msWidth" value="10mil"/>
<param name="msDrill" value="24mil"/>
<param name="msMicroVia" value="9.99mm"/>
<param name="msWidth" value="5mil"/>
<param name="msDrill" value="0.3mm"/>
<param name="msMicroVia" value="0.3mm"/>
<param name="msBlindViaRatio" value="0.5"/>
<param name="rvPadTop" value="0.25"/>
<param name="rvPadInner" value="0.25"/>
<param name="rvPadBottom" value="0.25"/>
<param name="rvViaOuter" value="0.25"/>
<param name="rvViaInner" value="0.25"/>
<param name="rvMicroViaOuter" value="0.25"/>
<param name="rvMicroViaInner" value="0.25"/>
<param name="rvPadTop" value="0.4"/>
<param name="rvPadInner" value="0"/>
<param name="rvPadBottom" value="0.4"/>
<param name="rvViaOuter" value="0"/>
<param name="rvViaInner" value="0"/>
<param name="rvMicroViaOuter" value="0"/>
<param name="rvMicroViaInner" value="0"/>
<param name="rlMinPadTop" value="10mil"/>
<param name="rlMaxPadTop" value="20mil"/>
<param name="rlMaxPadTop" value="80mil"/>
<param name="rlMinPadInner" value="10mil"/>
<param name="rlMaxPadInner" value="20mil"/>
<param name="rlMinPadBottom" value="10mil"/>
<param name="rlMaxPadBottom" value="20mil"/>
<param name="rlMinViaOuter" value="8mil"/>
<param name="rlMaxPadBottom" value="80mil"/>
<param name="rlMinViaOuter" value="3mil"/>
<param name="rlMaxViaOuter" value="20mil"/>
<param name="rlMinViaInner" value="8mil"/>
<param name="rlMaxViaInner" value="20mil"/>
<param name="rlMinMicroViaOuter" value="4mil"/>
<param name="rlMinMicroViaOuter" value="3mil"/>
<param name="rlMaxMicroViaOuter" value="20mil"/>
<param name="rlMinMicroViaInner" value="4mil"/>
<param name="rlMaxMicroViaInner" value="20mil"/>
@ -9882,7 +9874,7 @@ design rules under a new name.</description>
<param name="mlMaxStopFrame" value="4mil"/>
<param name="mlMinCreamFrame" value="0mil"/>
<param name="mlMaxCreamFrame" value="0mil"/>
<param name="mlViaStopLimit" value="0mil"/>
<param name="mlViaStopLimit" value="0.4mm"/>
<param name="srRoundness" value="0"/>
<param name="srMinRoundness" value="0mil"/>
<param name="srMaxRoundness" value="0mil"/>
@ -9997,8 +9989,11 @@ design rules under a new name.</description>
<element name="X1" library="iso7816-card" package="ISO7816_CARD" value="" x="42.8" y="26.75"/>
<element name="X2" library="laforge" package="FPC_JUSHUO_AFA07-S06" value="FCI_FPC_REBEL_SFW6R-1-JUSHUO-AFA07" x="94.234" y="28.194" smashed="yes" rot="R90">
<attribute name="NAME" x="99.314" y="36.576" size="1.27" layer="25" font="vector" ratio="14" rot="R180"/>
<attribute name="LCSC_PART" value="C72727" x="94.234" y="28.194" size="1.4224" layer="27" font="vector" ratio="14" rot="R90" display="off"/>
</element>
<element name="C1" library="rc-sysmocom" package="_0603" value="100n" x="90.932" y="24.638" rot="R90">
<attribute name="LCSC_PART" value="C30926" x="90.932" y="24.638" size="1.4224" layer="27" font="vector" ratio="14" rot="R90" display="off"/>
</element>
<element name="C1" library="rc-sysmocom" package="_0603" value="" x="90.932" y="24.638" rot="R90"/>
<element name="U$1" library="laforge" package="WEEE_BIN_TOP" value="" x="77.724" y="11.43" rot="MR0"/>
<element name="U$2" library="laforge" package="WEEE_BIN" value="" x="77.724" y="8.89" rot="MR0"/>
<element name="U$3" library="oshw" package="OSHW_8MM" value="" x="93.726" y="8.382"/>

View File

@ -877,7 +877,7 @@ High volt MLC; no solder stop between for higher isolation</description>
<part name="X1" library="iso7816-card" deviceset="SMARTCARD" device=""/>
<part name="FRAME1" library="frames" deviceset="DINA4_L" device=""/>
<part name="X2" library="laforge" deviceset="FCI_FPC_REBEL_SFW6R-1" device="-JUSHUO-AFA07" value="FCI_FPC_REBEL_SFW6R-1-JUSHUO-AFA07"/>
<part name="C1" library="rc-sysmocom" deviceset="CAP_CERAMIC" device="_0603"/>
<part name="C1" library="rc-sysmocom" deviceset="CAP_CERAMIC" device="_0603" value="100n"/>
</parts>
<sheets>
<sheet>