We did have
* _HPRE_SYSCLK_DIVN (3 parts)
* _HPRE_DIVN (5 parts)
* _HPRE_DIV_N (4 parts)
Unify all on _HPRE_DIVN. Provide deprecated definitions to not break
everything at once.
Also, standardize on "NODIV" instead of DIVNONE.
You can't have two mainpage items, and the second was just being
ignored. This restores them, which makes the left side list longer,
which we may or may not like, but it's at least how it was documented to
be.
GD32F1X0 (X can be 3, 5, 7 and 9) is a series of Cortex-M3 MCUs by
GigaDevice, which features pin-to-pin package compatibility with
STM32F030 MCU line. F150 adds USB support to F130, and F170/F190 adds
CAN support.
Currently the code mainly targets GD32F130 and F150 chips. Some register
are different between F130/150 and F170/190, just like the difference
between STM32F1 Performance line and Connectivity line.
From the perspective of registers and memory map, GD32F1X0 seems like a
mixture between STM32F1 and STM32F0 (because it is designed to be
pin-to-pin compatible with F0, but with Cortex-M3 like F1). A bunch of
code are shared between STM32 and GD32, and these code are specially
processed to include the GD32 headers instead of STM32 headers when meet
GD32F1X0.
Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Reviewed-by: Karl Palsson <karlp@tweak.net.au>
gd32/rcc.[ch] are forks of stm32f1/rcc
gd32/flash.[ch] are forks of stm32f0/flash
No attempts at deduplicating this have been done at this stage. We can
see where they move in the future.
Karl Palsson