dect
/
linux-2.6
Archived
13
0
Fork 0
Code Releases Activity

thermal: re-document thermal units 

From: Zhang Rui <rui.zhang@intel.com>

(reverting the previous sysfs patch also reverted a fix
 to the thermal units documentation, which is restored by this commit)

The generic thermal driver shows temperature in millidegree Celsius.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
This commit is contained in:
Zhang, Rui 2008-03-18 10:40:29 +08:00 committed by Len Brown
parent 91f57fa121
commit 6d7f014e55
1 changed files with 11 additions and 11 deletions
Show Stats Download Patch File Download Diff File Expand all files Collapse all files

22
Documentation/thermal/sysfs-api.txt
View File

@ -143,10 +143,10 @@ type Strings which represent the thermal zone type.
This is given by thermal zone driver as part of registration. This is given by thermal zone driver as part of registration.
Eg: "ACPI thermal zone" indicates it's a ACPI thermal device Eg: "ACPI thermal zone" indicates it's a ACPI thermal device
RO RO
Optional Required
temp Current temperature as reported by thermal zone (sensor) temp Current temperature as reported by thermal zone (sensor)
Unit: degree Celsius Unit: millidegree Celsius
RO RO
Required Required
@ -163,7 +163,7 @@ mode One of the predefined values in [kernel, user]
charge of the thermal management. charge of the thermal management.
trip_point_[0-*]_temp The temperature above which trip point will be fired trip_point_[0-*]_temp The temperature above which trip point will be fired
Unit: degree Celsius Unit: millidegree Celsius
RO RO
Optional Optional
@ -193,7 +193,7 @@ type String which represents the type of device
eg. For memory controller device on intel_menlow platform: eg. For memory controller device on intel_menlow platform:
this should be "Memory controller" this should be "Memory controller"
RO RO
Optional Required
max_state The maximum permissible cooling state of this cooling device. max_state The maximum permissible cooling state of this cooling device.
RO RO
@ -219,16 +219,16 @@ the sys I/F structure will be built like this:
|thermal_zone1: |thermal_zone1:
|-----type: ACPI thermal zone |-----type: ACPI thermal zone
|-----temp: 37 |-----temp: 37000
|-----mode: kernel |-----mode: kernel
|-----trip_point_0_temp: 100 |-----trip_point_0_temp: 100000
|-----trip_point_0_type: critical |-----trip_point_0_type: critical
|-----trip_point_1_temp: 80 |-----trip_point_1_temp: 80000
|-----trip_point_1_type: passive |-----trip_point_1_type: passive
|-----trip_point_2_temp: 70 |-----trip_point_2_temp: 70000
|-----trip_point_2_type: active[0] |-----trip_point_2_type: active0
|-----trip_point_3_temp: 60 |-----trip_point_3_temp: 60000
|-----trip_point_3_type: active[1] |-----trip_point_3_type: active1
|-----cdev0: --->/sys/class/thermal/cooling_device0 |-----cdev0: --->/sys/class/thermal/cooling_device0
|-----cdev0_trip_point: 1 /* cdev0 can be used for passive */ |-----cdev0_trip_point: 1 /* cdev0 can be used for passive */
|-----cdev1: --->/sys/class/thermal/cooling_device3 |-----cdev1: --->/sys/class/thermal/cooling_device3